The group's principal activity is to design, manufacture and market capital equipment, packaging materials and test interconnect solutions and services. The group manufactures a line of bonding wire and wire bonders that are used on an integrated circuit package. It also manufactures fixtures that are used for connecting automatic test equipment to the semiconductor device under test during wafer fabrication. The group's flip chip business unit licenses its flip chip technology and provides flip chip bumping and wafer level packaging services. The group caters to the companies that manufacture and assemble semiconductor devices. Major customers include advanced micro devices, advanced semiconductor engineering, chippac, general dynamics and other semiconductor manufacturers that primarily operate in the Asia/pacific.
