The group's principal activity is to develop, manufacture and supply polishing slurries. This is supplied to the semiconductor industry for usage in chemical mechanical planarization (cmp). Cmp is a polishing process used by ic device manufacturers to planarize many of the multiple layers of material that are built upon silicon wafers to produce advanced devices. The polishing slurries are used in chemical mechanical planarization process to remove excess materials that are deposited on multiple layers that are built upon silicon wafers. Cmp enables ic device manufacturers to produce smaller ic devices with greater density, both of which improve the performance and capabilities of the device. The group markets the products through independent distributors and other industry suppliers. The products of the group are sold in the United States, Europe and Asia.
