Business Information
The group's principal activity is the design, manufacture and sale of equipment and materials used to produce semiconductor devices or integrated circuits. The group also provides solutions for the main areas of semiconductor production, namely wafer processing, assembly and packaging. Products fall into two categories: front end: semiconductor wafer fabrication equipment, such as epitaxial reactors, cluster tools, vertical furnaces, rapid thermal process equipment, atomic layer cvd tools; back end: equipment for assembly of integrated circuits, such as die attach tools, wire bonders, trim and form equipment, encapsulation mould tools, assembly automation & test equipment.
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Name |
Title
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Email
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| Arthur Del Prado | Chmn., CEO | N/A | | Fukumi Tomino | Regional Mgr. - Front, end Operations Asia, MD - ASM Japan KK | N/A | | Lee Kwong | Member - Management Board, CEO - ASM Pacific Technology Ltd | N/A | | Patrick See Pong | VP - Asian Operations, MD - ASM Pacific Technology Ltd | N/A | | W. Lee | CEO - ASM Pacific Technology Ltd | N/A |
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Year |
Sales |
Net Income |
| 2006 | 1,158,551 | 45,331 | | 2005 | 860,369 | (47,633) | | 2004 | 1,029,092 | 32,799
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