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William J. Grundmann is an Intel Fellow, Mobile Platforms Group, and Director, Computer-Aided Design Research. He is responsible for the direction and development of design methodology and computer-aided design (CAD) tools for Intel's microprocessor design.
Grundmann joined Intel as part of a June 2001 agreement with Compaq Computer Corporation that called for the transfer of microprocessor engineering and design expertise to Intel.
Prior to joining Intel, he was a Compaq Fellow and CAD Director for the Alpha Microprocessor Group. His responsibilities included specification and development of design methodologies, and CAD tools for microprocessor design. In addition to his CAD background, his experiences includes managing, architectural design and being a hardware designer of seven microprocessor chips and ten peripheral support chip designs.
From 1981 to 1998, Grundmann was a Senior Consulting Engineer for Digital Equipment Corporation. Before joining Digital, he was a Hardware Design Engineer at Intel from 1980 to 1981, and at National Semiconductor from 1974 to 1980.
Grundmann received his bachelor's degree in electrical engineering from Oklahoma State University in 1974. He holds eight patents.
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