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Tom has extensive experience in the development of ceramic materials, including AlN based products. Tom was part of the original team that developed the AlN substrate process that led to more advanced mutilayer packaging designs. Tom earned an M.S. in Solid State Physics at John Carroll University and has worked in material science related industries. Tom applied his high temperature furnace knowledge toward understanding of sintering and brazing mechanisms. His team produced an AlN substrate that had the highest thermal conductivity in the industry. Currently, Tom's duties as CMC Interconnect Technologies include failure analysis and support for the co-fire ink requirements of our AlN licensees. | 