|
Mr. Fiordalice, who joined Intermolecular in May 2006, has more than 16 years of semiconductor industry experience. Prior to joining Intermolecular, he worked for KLA-Tencor Corp., where he was responsible for negotiating and managing global strategic technical alliances. Prior to that, he managed the advanced interconnect group at Motorola Inc.’s Advanced Research and Development Laboratory. In that position, he was responsible for the introduction of copper interconnects and low-k dielectrics for advanced products. He holds 22 U.S. patents and has more than 60 published articles on semiconductor technology. He received B.S. degrees in genetics and microbiology from the University of California, Berkeley, and in physics from Syracuse University, as well as an M.S. degree in physics and solid state physics from North Carolina State University.
| 