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Professor Tummala, founding director of the Microelectronics Packaging Research Center, is currently an Endowed Chair Professor of Electrical and Computer Engineering and Materials Science and Engineering at the Georgia Institute of Technology. He is also an Eminent Scholar for the State of Georgia and was recently named Temasek Professor at the National University of Singapore where he leads a joint program between NUS, the Institute of Microelectronics of Singapore and Georgia Tech in Nano wafer level packaging. Additionally, Dr. Tummala is President of the IEEE-CPMT Society. Prior to joining Georgia Tech, Professor Tummala was an IBM fellow where he pioneered and introduced several major packaging technologies including the industry's first MCM, LTCC packaging and flat panel display. | 