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Mr. Pollard's practice includes the preparation and prosecution of domestic, foreign and international patent applications, and trademark applications. His practice also includes client counseling on related matters.
Technical Expertise
Mr. Pollard's engineering experience spans over ten years in applied research and development. His broad experience includes semiconductor packaging, processing and system integration; development of thermo-fluid, refrigeration, control and propulsion systems; research related to heat transfer and fluid mechanics; software development; and analysis of structural components and systems.
Mr. Pollard is co-inventor on eleven U.S. patents, several of which have been granted in foreign jurisdictions, and he is co-author of two published technical papers.
Bar Admissions
Oregon, 2007
Prior Professional Experience
Intel Corporation
Patent Engineer (2004-2006)
Senior Packaging Engineer ( 1997-2004)
U.S. District Court for the District of Oregon
Deputy clerk to the Honorable John P. Cooney (Retired) and the Honorable Owen M. Panner (2006)
Georgia Institute of Technology, Dept. of Mechanical Engineering
Member, M.S. Thesis Advisory Committee (2001-2002)
Portland State University, Dept. of Mechanical Engineering
Adjunct Professor, Thermodynamics/Fluid Mechanics (2001)
University of Arizona, Dept. of Mechanical Engineering
Research Assistant (1995-1997)
Presentations and Publications
Thermal Analysis and Validation of MCMs: SEMITHERM Proc. 2000, March 21-23, 2000
Incorporating Power and Thermal Analysis in Platform Memory Performance Models: Design & Test Technology Conference 2005, Aug. 15-19, 2005
US Patent No. 5,966,287 (1999): Clip on Heat Exchanger for a Memory Module and Assembly Method
US Patent No. 6,130,819 (2000): Fan Duct Module
US Patent No. 6,154,365 (2000): Spring Fixture that Attaches a Heat Sink Used in High Density Packaging Applications
US Patent No. 6,260,613 (2001): Transient Cooling Augmentation for Electronic Components
US Patent No. 6,479,895 (2002): High Performance Air Cooled Heat Sinks Used in High Density Packaging Applications
US Patent No. 6,501,655 (2002): High Performance Fin Configuration for Air Cooled Heat Sinks. Also granted protection in the European Union.
US Patent No. 6,507,530 (2003): Weighted Throttling Mechanism with Rank Based Throttling for a Memory Subsystem
US Patent No. 6,577,504 (2003): Integrated Heat Sink for Different Size Components with EMI Suppresion Features
US Patent No. 6,633,484 (2003): Heat Dissipating Devices, Systems, and Methods with Small Footprint
US Patent No. 6,705,144 (2004): Manufacturing Process for Radial Fin Heat Sink
US Patent No. 7,050,959 (2006): Dynamic Thermal Management for Integrated Circuits
Year Joined Firm
2007 | 