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Jim Young has over 24 years experience in technology companies including start-ups and Fortune 20 companies. Before joining Xytrans, he was Executive Vice President responsible for the design and technology development as well as sales and marketing at Intarsia Corporation, a company specializing in advanced components for the mobile wireless and computing markets. Prior to Intarsia, Jim was president of ChipScale Inc., a pioneer in the emerging wafer-level semiconductor packaging market. Before assuming the role of President of ChipScale, Jim had responsibility for operations where he was responsible for developing key packaging technologies and improvement in efficiencies in production. Jim also spent 13 years with DuPont in a variety of key roles including manufacturing, planning, information systems, sales, and marketing. He has been awarded six patents in the areas of wafer-level semiconductor packaging. Jim earned a BS in engineering from the U.S. Military Academy at West Point. | 