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George has over 17 years of experience in electronic packaging design and research; previously, he worked at Georgia tech, Motorola and IBM. George was a member of the faculty at the Georgia Institute of Technology where he lead the System on Package (SOP) thin film electronic package development at Tech's Packaging Research Center. At Motorola, he led the embedded passive program for organic PWBs. Technology developed through this effort will be implemented in Motorola's next generation of mobile handsets. He also led IBM's thin film conformal via MCM-D process development that is currently being used for IBM's high-performance computers. George holds over 14 patents in electronic packaging and is the author of numerous publications in electronic packaging technology. | 