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Bo Liu joined Magnum in October 2005 from Mediatek, where he served as vice president of China software engineering. He brings 20 years of software development and customer application experience to Magnum. Prior to Mediatek, Liu served as vice president of software development for Tvia, Inc., a fabless semiconductor company which designs display processors for various multimedia devices. Prior employment includes lead software engineering positions at Micronics Computers and Oak Technology.Liu earned a BSEE from Hefei Polytechnic University in Hefei, China and was awarded an MSEE from Wichita State University, Kansas. He was also a Ph.D. candidate at the University of Wisconsin - Madison. | 